Fabrication method of packaging substrate

ABSTRACT

A method for fabricating a packaging substrate includes: providing a carrier having a first metal layer and a second metal layer formed on the first metal layer; forming a first circuit layer on the second metal layer and forming a separating portion on an edge of the second metal layer such that the separating portion is spaced from the first circuit layer; forming a dielectric layer on the second metal layer and the first circuit layer such that the first circuit layer and the separating portion are embedded in the dielectric layer and portions of the dielectric layer are formed between the first circuit layer and the separating portion; forming a second circuit layer on the dielectric layer; and applying forces on the separating portion so as to remove the first metal layer and the carrier, thereby maintaining the integrity of the first circuit layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to packaging substrates and fabricationmethods thereof, and, more particularly, to a packaging substrate forcarrying a semiconductor chip and a fabrication method thereof.

2. Description of Related Art

Along with the rapid development of electronic industries, electronicproducts are developed towards multi-function and high performance.Packaging substrates used for carrying semiconductor chips are requiredto have reduced thicknesses to meet the miniaturization requirement ofsemiconductor packages.

However, decreasing thickness of packaging substrates increases problemsin fabrication. For example, such a packaging substrate can easily getstuck when it is moved across various processing stations, thusadversely affecting the fabrication efficiency. Further, such apackaging substrate can easily warp or crack due to its reducedthickness, which accordingly leads to an undesired product yield.

Therefore, small leadless packages (SLPs) are provided. In particular, acarrier is added to one side of a packaging substrate during fabricationand removed after the molding process, thereby meeting miniaturizationrequirement, facilitating mass production and reducing fabrication cost.

Referring to FIG. 1A, a packaging substrate 1 used in a small leadlesspackage has a carrier 10 having a first copper lamination layer 101 anda second copper lamination layer 102 formed on the first copperlamination layer 101, and a base body 1 a disposed on the second copperlamination layer 102. The first and second copper lamination layers 101,102 are laminated together through vacuum lamination.

The base body 1 a has a first circuit layer 11 formed on the secondcopper lamination layer 102 through electroplating, a dielectric layer12 formed on the second copper lamination layer 102 and the firstcircuit layer 11, a second circuit layer 13 formed on the dielectriclayer 12 through electroplating, a plurality of conductive vias 14formed in the dielectric layer 12 through electroplating forelectrically connecting the first and second circuit layers 11, 13, andan protection layer 15 formed on the dielectric layer 12 and the secondcircuit layer 13.

Referring to FIG. 1B, the first copper lamination layer 101 is separatedand removed from the second copper lamination layer 102 through a vacuumbreaking process so as to remove the carrier 10.

However, since the first circuit layer 11 is made of an electroplatedcopper material, the bonding force between the first circuit layer 11(electroplated copper) and the second copper lamination layer 102(laminated copper) is greater than the bonding force between the firstcircuit layer 11 (electroplated copper) and the dielectric layer 12(non-metal material). As such, when the first copper lamination layer101 is removed along with an edge portion of the second copperlamination layer 102 a, a portion of the first circuit layer 11 a isalso removed due to the great bonding force between the second copperlamination layer 102 a and the first circuit layer 11 a, therebydamaging the first circuit layer 11 and reducing the product yield.

Therefore, there is a need to provide a packaging substrate and afabrication method thereof so as to overcome the above-describeddrawbacks.

SUMMARY OF THE INVENTION

Accordingly, the present invention provides a fabrication method of apackaging substrate, which comprises the steps of: providing a carrierhaving a first metal layer and a second metal layer laminated on thefirst metal layer; forming a first circuit layer on the second metallayer and forming a separating portion on an edge of the second metallayer such that the separating portion is spaced from the first circuitlayer; forming a dielectric layer on the second metal layer and thefirst circuit layer such that the first circuit layer and the separatingportion are embedded in the dielectric layer and a portion of thedielectric layer is positioned between the first circuit layer and theseparating portion; forming a second circuit layer on the dielectriclayer and forming a plurality of conductive vias in the dielectric layerfor electrically connecting the first and second circuit layers; andremoving the separating portion along with a portion of the second metallayer under the separating portion so as to remove the first metal layerand the carrier along an edge of the carrier, thereby forming a recessportion on an edge of the dielectric layer and maintaining the remainingportion of the second metal layer on the dielectric layer and the firstcircuit layer, wherein the recess portion is exposed from the remainingportion of the second metal layer.

The present invention further provides a packaging substrate, whichcomprises: a carrier having a first metal layer and a second metal layerlaminated on the first metal layer; a first circuit layer formed on thesecond metal layer; a separating portion formed on an edge of the secondmetal layer; a dielectric layer formed on the second metal layer suchthat the first circuit layer and the separating portion are embedded inthe dielectric layer and a portion of the dielectric layer is positionedbetween the first circuit layer and the separating portion; and a secondcircuit layer formed on the dielectric layer, wherein portions of thesecond circuit layer are embedded in the dielectric layer forelectrically connecting the first circuit layer.

In the above-described packaging substrate and fabrication method, thefirst metal layer and the second metal layer are laminated togetherthrough vacuum lamination.

The present invention further provides another packaging substrate,which comprises: a dielectric layer having a first surface with a recessportion on an edge thereof and a second surface opposite to the firstsurface; a first circuit layer embedded in the first surface of thedielectric layer, wherein a portion of the dielectric layer ispositioned between the first circuit layer and the recess portion; ametal layer formed on the first surface of the dielectric layer and thefirst circuit layer while exposing the recess portion; and a secondcircuit layer formed on the second surface of the dielectric layer,wherein portions of the second circuit layer are embedded in thedielectric layer for electrically connecting the first circuit layer.

In the above-described packaging substrates and fabrication method, anprotection layer can be formed on the dielectric layer and the secondcircuit layer and have a plurality of openings for exposing portions ofthe second circuit layer. Further, a surface treatment layer can beformed on the portions of the second circuit layer exposed through theopenings of the protection layer.

Furthermore, a semiconductor chip can be disposed on the protectionlayer and electrically connected to the second circuit layer through aplurality of bonding wires, and an encapsulant can be formed on theprotection layer for encapsulating the semiconductor chip and thebonding wires.

Therefore, by forming a separating portion on an edge of the secondmetal layer and forms a dielectric layer between the first circuit layerand the separating portion, the present invention allows forces to beapplied on the separating portion and a portion of the second metallayer under the separating portion so as to remove the first metal layerand the carrier. Since the bonding force between the dielectric layerand the second metal layer is greater than the bonding force between thetwo metal layers, the second metal layer remains on the dielectric layerwithout being removed. As such, the present invention avoids removal ofthe second metal layer along with the first circuit layer as occurs inthe prior art, thereby keeping the integrity of the first circuit layerand improving the product yield.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are schematic cross-sectional views showing afabrication method of a conventional packaging substrate;

FIG. 1C is a partially enlarged view of FIG. 1B;

FIGS. 2A and 2B are schematic cross-sectional views showing afabrication method of a packaging substrate according to the presentinvention, wherein FIG. 2A′ is an upper view of FIG. 2A; and

FIG. 2C shows a subsequent process of FIG. 2B.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The following illustrative embodiments are provided to illustrate thedisclosure of the present invention, these and other advantages andeffects can be apparent to those in the art after reading thisspecification.

It should be noted that all the drawings are not intended to limit thepresent invention. Various modification and variations can be madewithout departing from the spirit of the present invention. Further,terms such as “one”, “on”, “top”, “bottom” etc. are merely forillustrative purpose and should not be construed to limit the scope ofthe present invention.

FIGS. 2A and 2B are schematic cross-sectional views showing afabrication method of a packaging substrate according to the presentinvention.

Referring to FIGS. 2A and 2A′, a carrier 20 has a copper clad laminate(CCL) 20 a and a bonding layer 200 formed on the copper clad laminate 20a. A first metal layer 201 is formed on the bonding layer 200 and asecond metal layer 202 is laminated on the first metal layer 201.

Then, through an electroplating process, a first circuit layer 21 isformed on the second metal layer 202, and a separating portion 29 isformed on an edge of the second metal layer 202 such that a gap L isformed between the first circuit layer 21 and the separating portion 29.

Then, a dielectric layer 22 is formed on the second metal layer 202 andthe first circuit layer 21 such that the first circuit layer 21 and theseparating portion 29 are embedded in the dielectric layer 22 and aportion of the dielectric layer 22′ is positioned in the gap L betweenthe first circuit layer 21 and the separating portion 29.

Thereafter, through an electroplating process, a second circuit layer 23is formed on the dielectric layer 22 and a plurality of conductive vias24 are formed in the dielectric layer 22 for electrically connecting thefirst and second circuit layers 21, 23.

Further, an protection layer 25 is formed on the dielectric layer 22 andthe second circuit layer 23 and has a plurality of openings 250 formedtherein such that portions of the second circuit layer 23 are exposedthrough the openings 250 to serve as conductive pads. Furthermore, asurface treatment layer 26 can be formed on the portions of the secondcircuit layer 23 exposed through the openings 250 of the protectionlayer 25.

In the present embodiment, the first metal layer 201 and the secondmetal layer 202 are made of copper. The first metal layer 201 and thesecond metal layer 202 are laminated together through vacuum lamination.The bonding layer 200 can be made of a dielectric material, aninsulating material or an adhesive material. Various types of copperclad laminates are well known in the art and detailed descriptionthereof is omitted herein.

The dielectric layer 22 is made of prepreg (PP). The first circuit layer21 and the separating portion 29 are made of copper. The first circuitlayer 21 and the separating portion 29 can be simultaneously fabricatedthrough electroplating. Related circuit fabrication processes are wellknown in the art and have no special limitations.

The surface treatment layer 26 is made of Ni/Au, electrolessnickel/electroless palladium/immersion gold (ENEPIG) or direct immersiongold (DIG).

Further, referring to FIG. 2A′, the separating portion 29 is located ona corner of the packaging substrate so as to function as a staring pointfor a subsequent removal process. Dashed rectangles S in FIG. 2A′ definea plurality of substrate units for mounting semiconductor chips. After amolding process, the substrate units can be singulated into a pluralityof package units. Further, the packaging substrate 2 has a positioningcutting corner 203, a plurality of positioning holes 204 at an edgethereof and molding gates 280 used for a subsequent molding process.

Referring to FIG. 2B, the dielectric layer 22′ between the first circuitlayer 21 and the separating portion 29 is laminated with the secondmetal layer 202, and the bonding force between the dielectric layer 22′and a laminated copper material, i.e., the second metal layer 202 isgreater than the bonding force between two laminated copper materials,i.e., the first and second metal layers 201,202.

To remove the first metal layer 201 through a vacuum breaking process,forces are applied on the separating portion 29 (electroplated copper)and a portion of the second metal layer 202 a under the separatingportion 29 a. Since the bonding force between electroplated copper andlaminated copper is greater than the bonding force between electroplatedcopper and non-metal material, the separating portion 29 and the portionof the second metal layer 202 a under the separating portion 29 a areremoved to thereby remove the first metal layer 201 and the carrier 20along an edge of the carrier 20.

Since the bonding force between the dielectric layer 22′ and the secondmetal layer 202 is greater than the bonding force between the firstmetal layer 201 and the second metal layer 202, the dielectric layer 22′and the second metal layer 202 are securely laminated together such thatwhen the edge portion 202 a of the second metal layer is removed, thesecond metal layer 202 remains on the dielectric layer 22′ without beingremoved. Therefore, the present invention avoids removal of the firstcircuit layer 21 as in the prior art and maintains the integrity of thefirst circuit layer 21.

After the first metal layer 201 and the carrier 20 are removed, a recessportion 220 is formed on an edge of the dielectric layer 22, the secondmetal layer 202′ remains on the dielectric layer 22 and the firstcircuit layer 21 and the recess portion 220 is exposed from the secondmetal layer 202′.

Further referring to FIG. 2C, a semiconductor chip 27 is disposed on theprotection layer 25 through the positioning cutting corner 203 (as shownin FIG. 2A′) and positioning marks (not shown), and electricallyconnected to the second circuit layer 23 in the openings 250 through aplurality of bonding wires 270. Next, by performing a molding processusing a mold and the molding gates 280 (as shown in FIG. 2A′), anencapsulant 28 is formed to encapsulate the semiconductor chip 27 andthe bonding wires 270. The molding gates have a Ni/Au plating layer tofacilitate removal of molding residues after the molding process. Someof the molding gates are disposed between at least two substrate unitsand some of the molding gates correspond in position to single substrateunits. During the molding process, the mold is aligned with thepackaging substrate through the positioning holes 204 (as shown in FIG.2A′). In other embodiments, the molding process is performed before theremoving process of FIG. 2B.

The present invention further provides a packaging substrate 2 as shownin FIG. 2A, which has: a carrier 20 having a first metal layer 201 and asecond metal layer 202 laminated on the first metal layer 201, a firstcircuit layer 21 formed on the second metal layer 202, a separatingportion 29 formed on an edge of the second metal layer 202; a dielectriclayer 22 formed on the second metal layer 202 such that the firstcircuit layer 21 and the separating portion 29 are embedded in thedielectric layer 22 and a portion of the dielectric layer 22′ ispositioned between the first circuit layer 21 and the separating portion29, a second circuit layer 23 disposed on the dielectric layer 22, andan protection layer 25 formed on the dielectric layer 22 and the secondcircuit layer 23.

The second circuit layer 23 has conductive vias 24 formed in thedielectric layer 22 for electrically connecting the first circuit layer21.

The protection layer 25 has a plurality of openings 250 formed thereinsuch that portions of the second circuit layer 23 are exposed throughthe openings 250 so as for a surface treatment layer 26 to be formedthereon.

The present invention further provides a packaging substrate 2 a asshown in FIG. 2C, which has: a dielectric layer 22 having a firstsurface 22 a and a second surface 22 b opposite to the first surface 22a, a first circuit layer 21 embedded in the first surface 22 a of thedielectric layer 22, a second metal layer 202′ formed on the firstsurface 22 a of the dielectric layer 22 and the first circuit layer 21,a second circuit layer 23 formed on the second surface 22 b of thedielectric layer 22, and an protection layer 25 formed on the secondsurface 22 b of the dielectric layer 22 and the second circuit layer 23.

The first surface 22 a of the dielectric layer 22 has a recess portion220 at an edge thereof, and a portion of the dielectric layer 22′ ispositioned between the first circuit layer 21 and the recess portion220.

The first circuit layer 21 is flush with the first surface 22 a of thedielectric layer 22.

The recess portion 220 is exposed from the second metal layer 202′.

The second circuit layer 23 has a plurality of conductive vias 24 formedin the dielectric layer 22 for electrically connecting the first circuitlayer 21.

The protection layer 25 has a plurality of openings 250 formed thereinsuch that portions of the second circuit layer 23 are exposed throughthe openings 250 so as for a surface treatment layer 26 to be formedthereon.

Therefore, the present invention forms a separating portion 29 on anedge of the second metal layer 202 such that forces can be applied onthe separating portion 29 and a portion of the second metal layer 202 aunder the separating portion 29 to thereby remove the first metal layer201 and the carrier 20, thereby maintaining the integrity of the firstcircuit layer 21 and improving the product yield.

The above-described descriptions of the detailed embodiments are only toillustrate the preferred implementation according to the presentinvention, and it is not to limit the scope of the present invention.Accordingly, all modifications and variations completed by those withordinary skill in the art should fall within the scope of presentinvention defined by the appended claims.

1-11. (canceled)
 12. A fabrication method of a packaging substrate,comprising the steps of: providing a carrier having a first metal layerand a second metal layer formed thereon; forming a first circuit layeron the second metal layer and forming a separating portion on an edge ofthe second metal layer, wherein the separating portion is spaced fromthe first circuit layer; forming a dielectric layer on the second metallayer and the first circuit layer, so as for the first circuit layer andthe separating portion to be embedded in the dielectric layer, and aportion of the dielectric layer to be positioned between the firstcircuit layer and the separating portion; forming a second circuit layeron the dielectric layer and forming a plurality of conductive vias inthe dielectric layer for electrically connecting the first and secondcircuit layers; and removing the carrier and the first metal layer bythe separating portion.
 13. The fabrication method of claim 12, furthercomprising forming a protection layer on the dielectric layer and thesecond circuit layer and forming a plurality of openings in theprotection layer for exposing portions of the second circuit layer. 14.The fabrication method of claim 13, further comprising disposing asemiconductor chip on the protection layer and electrically connectingthe semiconductor chip and the second circuit layer through a pluralityof bonding wires and forming an encapsulant on the protection layer forencapsulating the semiconductor chip and the bonding wires.
 15. Thefabrication method of claim 13, further comprising forming a surfacetreatment layer on the portions of the second circuit layer exposedthrough the openings of the protection layer.
 16. The fabrication methodof claim 12, wherein the first and second metal layers are laminatedthrough vacuum lamination.